- Report
- March 2024
- 252 Pages
Global
From €4323EUR$4,950USD£3,755GBP
- Report
- February 2024
- 150 Pages
Global
From €4148EUR$4,750USD£3,604GBP
- Report
- April 2024
Global
From €3362EUR$3,850USD£2,921GBP
€4236EUR$4,850USD£3,680GBP
- Report
- January 2024
- 93 Pages
Global
From €3500EUR$4,293USD£3,147GBP
The Quad Flat Package (QFP) is a type of surface-mount packaging used for integrated circuits (ICs). It is a type of plastic leaded chip carrier (PLCC) that has gull-wing leads extending from all four sides of the package. QFPs are used in a wide range of applications, from consumer electronics to automotive and industrial applications.
QFPs are designed to provide a high level of electrical performance, with low inductance and capacitance, and high-speed signal transmission. They are also designed to be highly reliable, with a low failure rate. QFPs are also relatively small, making them suitable for use in space-constrained applications.
The QFP market within the semiconductor industry is highly competitive, with a number of major players offering a wide range of products. Companies in the market include Texas Instruments, STMicroelectronics, NXP Semiconductors, Renesas Electronics, and ON Semiconductor. Show Less Read more