Results for tag: "Solder Paste Inspection"

The Solder Paste Inspection (SPI) market within the semiconductor industry is a specialized segment of the overall semiconductor manufacturing process. SPI is used to ensure that the solder paste is correctly applied to the printed circuit board (PCB) during the assembly process. SPI systems use automated optical inspection (AOI) to detect any defects in the solder paste, such as misalignment, insufficient volume, or incorrect shape. This helps to ensure that the PCBs are correctly assembled and that the final product is of the highest quality. SPI systems are becoming increasingly important in the semiconductor industry as the demand for higher quality products increases. SPI systems are also becoming more sophisticated, with the use of 3D imaging and advanced algorithms to detect even the smallest defects. Some of the major companies in the SPI market include Koh Young Technology, Viscom, Mirtec, Omron, CyberOptics, and Nordson YESTECH. Show Less Read more