Results for tag: "Thin Film Encapsulation"

Thin Film Encapsulation (TFE) is a process used in the semiconductor industry to protect integrated circuits from environmental damage. It involves the deposition of a thin film of material, such as silicon dioxide, on the surface of the integrated circuit. This film acts as a barrier, preventing moisture, dust, and other contaminants from entering the circuit and causing damage. The process also helps to reduce the risk of electrical shorts and other electrical problems. TFE is an important part of the semiconductor manufacturing process, as it helps to ensure the reliability and performance of the finished product. It is also used to improve the electrical properties of the integrated circuit, such as reducing the resistance and capacitance of the circuit. Some of the companies in the TFE market include Applied Materials, ASM International, Lam Research, Tokyo Electron, and KLA-Tencor. Show Less Read more