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Results for tag: "Wafer Backgrinding Tape"

Europe Thin Wafer Market Size, Share & Industry Trends Analysis Report by Wafer Size (300 mm, 200 mm and 125 mm), Technology (Dicing, Polishing and Grinding), Application, Country and Growth Forecast, 2022-2028 - Product Thumbnail Image

Europe Thin Wafer Market Size, Share & Industry Trends Analysis Report by Wafer Size (300 mm, 200 mm and 125 mm), Technology (Dicing, Polishing and Grinding), Application, Country and Growth Forecast, 2022-2028

  • Report
  • October 2022
  • 93 Pages
  • Europe
From
Global Wafer Backgrinding Tape Market By Type, By Wafer Size, By Regional Outlook, Industry Analysis Report and Forecast, 2021-2027 - Product Thumbnail Image

Global Wafer Backgrinding Tape Market By Type, By Wafer Size, By Regional Outlook, Industry Analysis Report and Forecast, 2021-2027

  • Report
  • January 2022
  • 142 Pages
  • Global
From
LAMEA Wafer Backgrinding Tape Market By Type, By Wafer Size, By Country, Opportunity Analysis and Industry Forecast, 2021-2027 - Product Thumbnail Image

LAMEA Wafer Backgrinding Tape Market By Type, By Wafer Size, By Country, Opportunity Analysis and Industry Forecast, 2021-2027

  • Report
  • January 2022
  • 62 Pages
  • Middle East, Africa
From
Europe Wafer Backgrinding Tape Market By Type, By Wafer Size, By Country, Opportunity Analysis and Industry Forecast, 2021-2027 - Product Thumbnail Image

Europe Wafer Backgrinding Tape Market By Type, By Wafer Size, By Country, Opportunity Analysis and Industry Forecast, 2021-2027

  • Report
  • January 2022
  • 62 Pages
  • Europe
From
North America Wafer Backgrinding Tape Market By Type, By Wafer Size, By Country, Opportunity Analysis and Industry Forecast, 2021-2027 - Product Thumbnail Image

North America Wafer Backgrinding Tape Market By Type, By Wafer Size, By Country, Opportunity Analysis and Industry Forecast, 2021-2027

  • Report
  • January 2022
  • 55 Pages
  • North America
From
Asia Pacific Wafer Backgrinding Tape Market By Type, By Wafer Size, By Country, Opportunity Analysis and Industry Forecast, 2021-2027 - Product Thumbnail Image

Asia Pacific Wafer Backgrinding Tape Market By Type, By Wafer Size, By Country, Opportunity Analysis and Industry Forecast, 2021-2027

  • Report
  • January 2022
  • 62 Pages
  • Asia Pacific
From
Wafer Backgrinding Tape Market By Type and Wafer Size: Global Opportunity Analysis and Industry Forecast, 2021-2030 - Product Thumbnail Image

Wafer Backgrinding Tape Market By Type and Wafer Size: Global Opportunity Analysis and Industry Forecast, 2021-2030

  • Report
  • December 2021
  • 180 Pages
  • Global
From
  • 7 Results (Page 1 of 1)
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The Wafer Backgrinding Tape market is an important part of the semiconductor industry. It is used to protect the wafer during the backgrinding process, which is necessary for the production of semiconductor devices. The tape is designed to provide a secure bond between the wafer and the grinding wheel, while also protecting the wafer from damage. It is also used to reduce the amount of dust generated during the grinding process. The tape is available in a variety of materials, including polyimide, polyester, and polyethylene. The Wafer Backgrinding Tape market is highly competitive, with a number of companies offering products for the semiconductor industry. Some of the major players in the market include 3M, Nitto Denko, Sumitomo Bakelite, and Shin-Etsu Chemical. Show Less Read more