Global Fan-out Wafer Level Packaging Market 2017-2021

  • ID: 4143928
  • Report
  • Region: Global
  • 70 pages
  • TechNavio
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until May 31st 2018
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FEATURED COMPANIES

  • Rudolph Technologies
  • SEMES
  • STATS ChipPAC
  • STMicroelectronics
  • SUSS MicroTec
  • Texas Instruments
  • MORE
1h Free Analyst Time

Speak directly to the analyst to clarify any post sales queries you may have.

About Fan-Out Wafer Level Packaging

FOWLP is a chip packaging technology that is used to package an IC, while the IC is still part of the wafer. The technology has a smaller form factor, thinner flip-chip packages, supports I/O density, and allows the use of wafer level packaging with improved semiconductor technology nodes and multi-die package. Wafer-level packages have advantages, in terms of cost and form, in comparison to substrate-based flip-chip packages. The WLP can assemble small to medium pin count ICs in the thinnest and smallest possible footprint at low cost. This is driving its market demand.

The analysts forecast the global fan-out wafer level packaging market to grow at a CAGR of 47.76% during the period 2017-2021.

Covered in this report
The report covers the present scenario and the growth prospects of the global fan-out wafer level packaging market for 2017-2021. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:
- Americas
- APAC
- EMEA

The report, Global Fan-Out Wafer Level Packaging Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
- STATS ChipPAC
- TSMC
- Texas Instruments

Other prominent vendors
- Rudolph Technologies
- SEMES
- SUSS MicroTec
- STMicroelectronics
- Ultratech

Market drivers
- Growing application of semiconductor ICs in IoT.
- For a full, detailed list, view the full report

Market challenges
- Rapid technological changes in wafer processing.
- For a full, detailed list, view the full report

Market trends
- High adoption of semiconductor ICs in automobiles.
- For a full, detailed list, view the full report

Key questions answered in this report
- What will the market size be in 2021 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the Key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

You can request one free hour of the analyst’s time when you purchase this market report. Details are provided within the report.
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Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Rudolph Technologies
  • SEMES
  • STATS ChipPAC
  • STMicroelectronics
  • SUSS MicroTec
  • Texas Instruments
  • MORE
1h Free Analyst Time

Speak directly to the analyst to clarify any post sales queries you may have.

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction
  • Key market highlights
PART 05: Technology landscape
  • Semiconductor IC manufacturing process
  • WLP versus die-level packaging and assembly
  • Roadmap of semiconductor packaging industry
  • Ecosystem of semiconductor IC packaging industry
PART 06: Market landscape
  • Market size and forecast
  • Five forces analysis
PART 07: Market segmentation by application
  • Global FOWLP market by application
  • Analog and mixed IC
  • Wireless connectivity
  • Logic and memory IC
  • MEMS and sensors
  • CMOS image sensors
PART 08: Geographical segmentation
  • APAC
  • Americas
  • Europe
PART 09: Decision framework

PART 10: Drivers and challenges
  • Market drivers
  • Impact of drivers on key customer segments
  • Market challenges
  • Impact of challenges on key customer segments
PART 11: Market trends
  • Increase in wafer size
  • High adoption of semiconductor ICs in automobiles
  • Short replacement cycle of mobile devices
PART 12: Vendor landscape
  • Competitive scenario
  • Key vendors
  • Other prominent vendors
PART 13: Appendix
  • List of abbreviations
List of Exhibits
Exhibit 01: Semiconductor IC manufacturing process
Exhibit 02: Front-end chip formation steps
Exhibit 03: Back-end chip formation steps
Exhibit 04: Semiconductor packaging industry
Exhibit 05:.5D IC block diagram
Exhibit 06:D IC block diagram
Exhibit 07: Old semiconductor IC packaging industry supply chain
Exhibit 08: New semiconductor IC packaging industry supply chain
Exhibit 09: Global FOWLP market 2016-2021 ($ millions)
Exhibit 10: Five forces analysis
Exhibit 11: Global FOWLP market by application 2016-2021 (% share)
Exhibit 12: Global FOWLP market by application 2016-2021 ($ millions)
Exhibit 13: Global analog and mixed IC market 2016-2021 ($ millions)
Exhibit 14: Global wireless connectivity market 2016-2021 ($ millions)
Exhibit 15: Global logic and memory IC market 2016-2021 ($ millions)
Exhibit 16: Global MEMS and sensors market 2016-2021 ($ millions)
Exhibit 17: Global CMOS image sensor market 2016-2021 ($ billions)
Exhibit 18: Global FOWLP market forecast by geography 2016-2021 (% share)
Exhibit 19: Global FOWLP market forecast by geography 2016-2021 ($ millions)
Exhibit 20: FOWLP market in APAC 2016-2021 ($ millions)
Exhibit 21: FOWLP market in Americas 2016-2021 ($ millions)
Exhibit 22: FOWLP market in Europe 2016-2021 ($ millions)
Exhibit 23: Global MEMS market 2015-2020 ($ billions)
Exhibit 24: Global smartphone shipment forecast 2016-2021 (millions of units)
Exhibit 25: Impact of drivers
Exhibit 26: Impact of drivers
Exhibit 27: Impact of challenges
Exhibit 28: Impact of challenges
Exhibit 29: Timeline for semiconductor wafer size advances
Exhibit 30: Growth of car shipments 2015-2020 (%)
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FEATURED COMPANIES

  • Rudolph Technologies
  • SEMES
  • STATS ChipPAC
  • STMicroelectronics
  • SUSS MicroTec
  • Texas Instruments
  • MORE
1h Free Analyst Time

Speak directly to the analyst to clarify any post sales queries you may have.

New Report Released: – Global Fan-Out Wafer Level Packaging Market 2017-2021

The author of the report recognizes the following companies as the key players in the global fan-out wafer level packaging market: STATS ChipPAC, TSMC, and Texas Instruments.

Other Prominent Vendors in the market are: Rudolph Technologies, SEMES, SUSS MicroTec, STMicroelectronics, and Ultratech.

Commenting on the report, an analyst from the research team said: “One trend in market is high adoption of semiconductor ICs in automobiles. The automation and electrification of automobiles have increased the need for semiconductor wafers. Several types of semiconductor ICs are used in automotive products such as GPS, airbag control, anti-lock braking system (ABS), power doors and windows, car navigation and display, infotainment, collision detection technology, and automated driving. This will push the demand for WLP solutions for IC packaging used in the automobile segment.”

According to the report, one driver in market is growing application of semiconductor ICs in IoT. IoT is one of the fastest growing markets in the world, and more than 30 billion devices are estimated to be connected through the IoT by 2020, generating a total of about 52 trillion GBs of data. The devices connected through the IoT use sensors and actuators to collect and transmit data to a centralized location on a real-time basis. As this empowers the user to take an informed decision, the adoption of the IoT is increasing in several market segments, such as the consumer electronics, automotive, and medical. Furthermore, governments of many countries such as India are undertaking smart city projects, which will support the demand for IoT devices during the forecast period. For instance, smart city applications such as smart electronic meters use semiconductor devices to monitor the fluctuation in electricity transmission and consumption and send signals to adjust the flow of the current.

Further, the report states that one challenge in market is reliability issues in wafer-level SiP. Reliability of SiP is a significant challenge due to the heterogeneous integration of several elements that have several interconnect technologies in 2D and 3D construction due to the high number of interfaces, complex process flows, several materials, and their coefficients of thermal expansion and temperature budget during processing. This is challenging for WLSiP, including FOWLP. However, it is less critical due to the use of thin-film processing instead of flip-chip and wire bond and smaller package dimensions. FOWLP technology is efficient in the designing of power modules; however, there are technical reliability issues affecting the market adoption of FOWLP technology in the global market.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
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1h Free Analyst Time

Speak directly to the analyst to clarify any post sales queries you may have.

  • STATS ChipPAC
  • TSMC
  • Texas Instruments
  • Rudolph Technologies
  • SEMES
  • SUSS MicroTec
  • STMicroelectronics
  • Ultratech
Note: Product cover images may vary from those shown
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