Taiwanese IC Packaging & Testing Industry, 1Q 2018

  • ID: 4514795
  • Report
  • Region: Taiwan
  • 15 pages
  • Market Intelligence & Consulting Institute (MIC)
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FEATURED COMPANIES

  • Ardentec
  • ASE
  • Chipbond
  • ChipMOS
  • FATC
  • KYEC
  • MORE

The report finds that shipment value of the Taiwanese IC packaging and testing industry enjoyed both year-on-year and sequential growth in the fourth quarter of 2017, to over USD 3.8 billion. The industry is forecast to have grown year-on-year in the first quarter of 2018. Overall, the industry still managed to grow over 8% in 2017 compared to 2016.

List of Topics

  • This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.
  • Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world.
  • The content of this report is based on primary data obtained from interviews, and publicly available information.
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Ardentec
  • ASE
  • Chipbond
  • ChipMOS
  • FATC
  • KYEC
  • MORE

Taiwanese IC Packaging and Testing Industry Shipment Value, 2Q 2015 - 2Q 2018

Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 3Q 2015 - 2Q 2018

Taiwanese IC Packaging Industry Shipment Value , 3Q 2015 - 2Q 2018

Taiwanese IC Testing Industry Shipment Value , 3Q 2015 - 2Q 2018

Taiwanese IC Packaging Industry Shipment Value Rankings, 3Q 2015 - 4Q 2017

Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 3Q 2015 - 4Q 2017

Taiwanese IC Testing Industry’s Shipment Value Rankings, 3Q 2015 - 4Q 2017

Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 3Q 2015 - 4Q 2017

Taiwanese IC Packaging Industry Shipment Value by Customers' Origin, 3Q 2015 - 4Q 2017

Taiwanese IC Packaging Industry Shipment Value Share by Customers' Origin, 3Q 2015 - 4Q 2017

Taiwanese IC Testing Industry Shipment Value by Customers' Origin, 3Q 2015 - 4Q 2017

Taiwanese IC Testing Industry Shipment Value Share by Customers' Origin, 3Q 2015 - 4Q 2017

Exchange Rate, 3Q 2015 - 4Q 2017

Research Scope & Definitions

Note: Product cover images may vary from those shown
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  • ASE
  • Ardentec
  • ChipMOS
  • Chipbond
  • FATC
  • KYEC
  • OSE
  • PTI
  • SPIL
  • Sigurd
  • Walto
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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