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Global Fan-out Wafer Level Packaging (FOWLP) Market 2019-2023 - Product Image

Global Fan-out Wafer Level Packaging (FOWLP) Market 2019-2023

  • ID: 4704143
  • Report
  • Region: Global
  • 114 pages
  • TechNavio
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FEATURED COMPANIES

  • Amkor Technology
  • ASE Technology Holding
  • SAMSUNG ELECTRO-MECHANICS
  • STATS ChipPAC
  • MORE
The introduction of panel level packaging has reduced the overall cost of wafer level packaging. The overall cost of packaging is lowered by shifting the whole packaging process to a large size panel format. This allows simultaneous packaging of several components on the same substrate. Panel level packaging technology significantly reduces the manufacturing costs for substrate manufacturers, IDMs, OSAT companies, and fabless companies. The increasing demand for electronics across different industries will further drive the demand for panel level packaging and thereby boost fan-out wafer level packaging market growth. The analysts have predicted that the fan-out wafer level packaging (FOWLP) market will register a CAGR of almost 16% by 2023.

Market Overview

Increasing demand for compactly designed electronics

The demand for miniaturized semiconductor components is increasing. This is prompting semiconductor companies to develop new packaging technologies such as FOWLP which will reduce the overall size of packaged ICs. FOWLP technology is suitable for applications that require high power and extreme miniaturization. This packaging technology also reduces the packaging and testing costs by allowing the fabrication and testing at wafer level. The growing demand for compact electronics will further drive thee demand for FOWLP technology and thereby boost market growth.
Increased production costs due to warpage

Warping is the deformation of the wafer surface due to differential shrinkage of the material in the molded part. Warping makes the wafers unusable and since it occurs several times during FOWLP, the manufacturing cost of the wafer increases. Warping can occur after post mold cure (PMC), after back grinding of the EMC, or after the fabrication of redistribution layers (RDLs). Warpage increases the overall packaging and manufacturing cost which in turn hampers the growth of FOWLP market.

For the detailed list of factors that will drive and challenge the growth of the fan-out wafer level packaging (FOWLP) market during 2019-2023, view this report.

Competitive Landscape

The market appears to be concentrated and with the presence of few companies including Amkor Technology, and ASE Technology Holding the competitive environment is less intense. Factors such as the growing demand for compactly designed electronics, will provide considerable growth opportunities to fan-out wafer level packaging (FOWLP) companies. Amkor Technology, ASE Technology Holding, SAMSUNG ELECTRO-MECHANICS, STATS ChipPAC, and Taiwan Semiconductor Manufacturing Company are some of the major companies covered in this report.
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Amkor Technology
  • ASE Technology Holding
  • SAMSUNG ELECTRO-MECHANICS
  • STATS ChipPAC
  • MORE
PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: MARKET LANDSCAPE
  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis
PART 04: MARKET SIZING
  • Market definition
  • Market sizing 2018
  • Market size and forecast 2018-2023
PART 05: FIVE FORCES ANALYSIS
  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition
PART 06: MARKET SEGMENTATION BY TECHNOLOGY
  • Market segmentation by technology
  • Comparison by technology
  • High density FOWLP - Market size and forecast 2018-2023
  • Standard density FOWLP - Market size and forecast 2018-2023
  • Market opportunity by technology
PART 07: CUSTOMER LANDSCAPE

PART 08: GEOGRAPHIC LANDSCAPE
  • Geographic segmentation
  • Geographic comparison
  • APAC - Market size and forecast 2018-2023
  • Americas - Market size and forecast 2018-2023
  • EMEA - Market size and forecast 2018-2023
  • Key leading countries
  • Market opportunity
PART 09: DECISION FRAMEWORK

PART 10: DRIVERS AND CHALLENGES
  • Market drivers
  • Market challenges
PART 11: TRENDS
  • Increasing adoption of semiconductor ICs in automobiles
  • Introduction of panel level packaging
  • Incorporation of more functionalities in smartphones
PART 12: VENDOR LANDSCAPE
  • Overview
  • Landscape disruption
PART 13: VENDOR ANALYSIS
  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Amkor Technology
  • ASE Technology Holding
  • SAMSUNG ELECTRO-MECHANICS
  • STATS ChipPAC
  • Taiwan Semiconductor Manufacturing Company
PART 14: APPENDIX
  • Research methodology
  • List of abbreviations
List of Exhibits
Exhibit 01: Global advanced semiconductor packaging market
Exhibit 02: Segments of global advanced semiconductor packaging market
Exhibit 03: Market characteristics
Exhibit 04: Market Segment
Exhibit 05: Market definition - Inclusions and exclusions checklist
Exhibit 06: Market size 2018
Exhibit 07: Global market: Size and forecast 2018-2023 ($ millions)
Exhibit 08: Global market: Year-over-year growth 2019-2023 (%)
Exhibit 09: Five forces analysis 2018
Exhibit 10: Five forces analysis 2023
Exhibit 11: Bargaining power of buyers
Exhibit 12: Bargaining power of suppliers
Exhibit 13: Threat of new entrants
Exhibit 14: Threat of substitutes
Exhibit 15: Threat of rivalry
Exhibit 16: Market condition - Five forces 2018
Exhibit 17: Technology - Market share 2018-2023 (%)
Exhibit 18: Comparison by technology
Exhibit 19: High density FOWLP - Market size and forecast 2018-2023 ($ millions)
Exhibit 20: High density FOWLP - Year-over-year growth 2019-2023 (%)
Exhibit 21: Standard density FOWLP - Market size and forecast 2018-2023 ($ millions)
Exhibit 22: Standard density FOWLP - Year-over-year growth 2019-2023 (%)
Exhibit 23: Market opportunity by technology
Exhibit 24: Customer landscape
Exhibit 25: Market share by geography 2018-2023 (%)
Exhibit 26: Geographic comparison
Exhibit 27: APAC - Market size and forecast 2018-2023 ($ millions)
Exhibit 28: APAC - Year-over-year growth 2019-2023 (%)
Exhibit 29: Americas - Market size and forecast 2018-2023 ($ millions)
Exhibit 30: Americas - Year-over-year growth 2019-2023 (%)
Exhibit 31: EMEA - Market size and forecast 2018-2023 ($ millions)
Exhibit 32: EMEA - Year-over-year growth 2019-2023 (%)
Exhibit 33: Key leading countries
Exhibit 34: Market opportunity
Exhibit 35: Impact of drivers and challenges
Exhibit 36: Vendor landscape
Exhibit 37: Landscape disruption
Exhibit 38: Vendors covered
Exhibit 39: Vendor classification
Exhibit 40: Market positioning of vendors
Exhibit 41: Amkor Technology - Vendor overview
Exhibit 42: Amkor Technology - Organizational developments
Exhibit 43: Amkor Technology - Geographic focus
Exhibit 44: Amkor Technology - Key offerings
Exhibit 45: ASE Technology Holding - Vendor overview
Exhibit 46: ASE Technology Holding - Business segments
Exhibit 47: ASE Technology Holding - Organizational developments
Exhibit 48: ASE Technology Holding - Geographic focus
Exhibit 49: ASE Technology Holding - Segment focus
Exhibit 50: ASE Technology Holding - Key offerings
Exhibit 51: SAMSUNG ELECTRO-MECHANICS - Vendor overview
Exhibit 52: SAMSUNG ELECTRO-MECHANICS - Business segments
Exhibit 53: SAMSUNG ELECTRO-MECHANICS - Organizational developments
Exhibit 54: SAMSUNG ELECTRO-MECHANICS - Geographic focus
Exhibit 55: SAMSUNG ELECTRO-MECHANICS - Segment focus
Exhibit 56: SAMSUNG ELECTRO-MECHANICS - Key offerings
Exhibit 57: STATS ChipPAC - Vendor overview
Exhibit 58: STATS ChipPAC - Organizational developments
Exhibit 59: STATS ChipPAC - Geographic focus
Exhibit 60: STATS ChipPAC - Key offerings
Exhibit 61: Taiwan Semiconductor Manufacturing Company - Vendor overview
Exhibit 62: Taiwan Semiconductor Manufacturing Company - Organizational developments
Exhibit 63: Taiwan Semiconductor Manufacturing Company - Geographic focus
Exhibit 64: Taiwan Semiconductor Manufacturing Company - Key offerings
Exhibit 65: Validation techniques employed for market sizing
Exhibit 66: List of abbreviations
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Amkor Technology
  • ASE Technology Holding
  • SAMSUNG ELECTRO-MECHANICS
  • STATS ChipPAC
  • MORE
Global Fan-out Wafer Level Packaging (FOWLP) Market 2019-2023

The author of the report recognizes the following companies as the key players in the global fan-out wafer level packaging (FOWLP) market: Amkor Technology, ASE Technology Holding, SAMSUNG ELECTRO-MECHANICS, STATS ChipPAC, and Taiwan Semiconductor Manufacturing Company.

Commenting on the report, an analyst from the research team said: “Innovative technologies such as panel level packaging have helped in reducing the manufacturing and overall packaging cost. This will be a key trend riving the growth of FOWLP market during the forecast period.”

According to the report, one of the major drivers for this market is the growing demand for compactly designed electronics. This will drive the demand for fan-out wafer level packaging and thereby fuel market growth.

Further, the report states that one of the major factors hindering the growth of this market is the increased production costs due to warpage. Warpage results in wastage of wafers which increases the overall costs and thereby resricts market growth.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Note: Product cover images may vary from those shown
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  • Amkor Technology
  • ASE Technology Holding
  • SAMSUNG ELECTRO-MECHANICS
  • STATS ChipPAC
  • Taiwan Semiconductor Manufacturing Company
Note: Product cover images may vary from those shown
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