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Global Molded Interconnect Device (MID) Market 2020-2024Speak directly to the analyst to clarify any post sales queries you may have.
The molded interconnect device (MID) market is poised to grow by $ 862.93 mn during 2020-2024 progressing at a CAGR of 12% during the forecast period. The reports on molded interconnect device (MID) market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.
The report offers an up-to-date analysis regarding the current global market scenario, latest trends and drivers, and the overall market environment. The market is driven by the growth in demand for consumer electronic devices, increasing demand for miniaturized electronic components, and rising usage of MID in medical devices. In addition, growth in demand for consumer electronic devices is anticipated to boost the growth of the market as well.
The molded interconnect device (MID) market analysis includes process segment and geographic landscapes.
The molded interconnect device (MID) market is segmented as below:
By Process
- Two-shot molding
- LDS
- Others
By Geographic Landscapes
- APAC
- North America
- Europe
- South America
This study identifies the growing use of MID in automotive sector as one of the prime reasons driving the molded interconnect device (MID) market growth during the next few years. Also, increasing adoption of smart wearables, and rising focus on reduction of e-waste will lead to sizable demand in the market.
The study presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters. The molded interconnect device (MID) market covers the following areas:
- Molded interconnect device (MID) market sizing
- Molded interconnect device (MID) market forecast
- Molded interconnect device (MID) market industry analysis
This robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading molded interconnect device (MID) market vendors that include 2E mechatronic GmbH & Co. KG, Arlington Plating Co., Cicor Technologies Ltd., HARTING Technology Group, JOHNAN Corp., LPKF Laser & Electronics AG, MID Solutions GmbH, Multiple Dimensions AG, S2P smart plastic product, and TactoTek Oy. Also, the molded interconnect device (MID) market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage on all forthcoming growth opportunities.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
This study presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary.
The market research report provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast an accurate market growth.
Table of Contents
Executive Summary
Market Landscape
Market Sizing
Five Forces Analysis
Market segmentation by process
Geographic Landscape
Vendor Landscape
Vendor Analysis
Appendix
List of Exhibits
Executive Summary
The publisher recognizes the following companies as the key players in the global molded interconnect device (MID) market: 2E mechatronic GmbH & Co. KG, Arlington Plating Co., Cicor Technologies Ltd., HARTING Technology Group, JOHNAN Corp., LPKF Laser & Electronics AG, MID Solutions GmbH, Multiple Dimensions AG, S2P smart plastic product, and TactoTek Oy.Commenting on the report, an analyst from the research team said: "The latest trend gaining momentum in the market is growing use of mid in automotive sector."
According to the report, one of the major drivers for this market is the growth in demand for consumer electronic devices.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- 2E mechatronic GmbH & Co. KG
- Arlington Plating Co.
- Cicor Technologies Ltd.
- HARTING Technology Group
- JOHNAN Corp.
- LPKF Laser & Electronics AG
- MID Solutions GmbH
- Multiple Dimensions AG
- S2P smart plastic product
- TactoTek Oy
