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Global Molded Interconnect Device Market by Product Type, Process, Industry and Geography - Forecast to 2030

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    Report

  • 124 Pages
  • November 2023
  • Region: Global
  • IHR Insights
  • ID: 5903134
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In order to estimate the present size of the moulded interconnect device (MID) market, the study covered four main tasks. To gather data about the market, as well as its parent and peer markets, in-depth secondary research was conducted. The following stage involved conducting primary research to confirm these conclusions, hypotheses, and sizing with industry experts throughout the value chain. Two methodologies were utilised to approximate the overall market size: top-down and bottom-up. The size of the market for each section and subsegment was then estimated using data triangulation and market breakdown.

Numerous primary sources from the supply and demand sides were questioned during the main research phase to gather crucial qualitative and quantitative data for this report. Industry specialists including CEOs, VPs, marketing directors, directors of technology and innovation, and associated executives from significant firms and organisations in the moulded interconnect device (MID) sector were the main sources from the supply side. Following the completion of market engineering, which involved the computation of market statistics, market breakdown, market size estimates, market forecasting, and data triangulation, a significant amount of primary research was carried out in order to collect data and confirm and validate the crucial figures that were determined.

Several data triangulation techniques, in addition to top-down and bottom-up approaches, have been used throughout the market engineering process to estimate and validate the size of the dependent submarkets described in this study, as well as the moulded interconnect device (MID) market.

Molded Interconnect Device (MID) Market based on Product Type:

  • Antennae & Connectivity Modules
  • Sensors
  • Connectors & Switches
  • Lighting Systems
  • Others

Molded Interconnect Device (MID) Market based on Process:

  • Laser Direct Structuring (LDS)
  • Two-Shot Molding
  • Film Techniques

Molded Interconnect Device (MID) Market, by Vertical:

  • Telecommunications
  • Consumer Electronics
  • Automotive
  • Medical
  • Industrial
  • Military & Aerospace

Molded Interconnect Device (MID) Market based on Geography:

  • North America
  • Europe
  • Asia Pacific (APAC)
  • Latin America (LATAM)
  • Middle East and Africa (MEA)
The market for moulded connecting devices is divided into product categories such as lighting systems, sensors, connectors & switches, antennas & connectivity modules, and others. The category that generated the largest revenue share in the moulded interconnect device market in 2021 was antennas & connectivity modules. MIDs allow for the creation of new functionality as well as the downsizing of products because they can integrate mechanical and electrical components into nearly any type of connecting device.

The moulded interconnect device market is divided into three segments based on process: film methods, two-shot moulding, and laser direct structuring (LDS). In 2021, the moulded interconnect device market had a sizable revenue share from the two-shot moulding segment. A reliable and well-established technique for creating MIDs that is both affordable and consistent is two-shot moulding. The part is being made in two-shot moulding using two distinct moulding cycles, various thermostatic polymers, and an electroless plating procedure.

The market for moulded interconnect devices is divided into the following vertical segments: consumer electronics, automotive, medical, industrial, military & aerospace, and telecommunications. With the largest revenue share in the moulded interconnect device market in 2021, the consumer electronics category held the top spot. Electronic gadgets intended for daily use, such as those for entertainment, communications, and workplace productivity, are known as consumer electronics. Consumer electronics include almost all electronic equipment used for work, play, and communication.

The cloud native storage market is examined in North America, Europe, Asia Pacific, and Latin America based on region. The market for moulded interconnect devices saw its highest revenue share in the Asia Pacific region in 2021. The main causes of this include a number of Asian OEMs as well as producers of semiconductor devices and goods. In especially in South Korea, Taiwan, and China, the area has excelled in offering the most cutting-edge semiconductor fabrication services as well as electronic system assembly services. In addition, semiconductor electronics manufacturers gain a great deal from outsourcing their production to places like Taiwan and China.

Report Scope

  • This report illustrates the most vital attributes of the Molded Interconnect Device (MID) Market, which are driving and providing opportunities.
  • This research gives an in-depth analysis of the Molded Interconnect Device (MID) Market growth on the basis of several segments in the market.
  • This report presents the predictions of the past and present trends of the Molded Interconnect Device (MID) Market.
  • This study also presents the competitive analysis, such as key strategies and capabilities of major players of the Molded Interconnect Device (MID) Market.

Table of Contents

1. Executive Summary
2. Industry Outlook
2.1. Industry Overview
2.2. Industry Trends
3. Market Snapshot
3.1. Market Definition
3.2. Market Outlook
3.2.1. Porter Five Forces
3.3. Related Markets
4. Market characteristics
4.1. Market Overview
4.2. Market Segmentation
4.3. Market Dynamics
4.3.1. Drivers
4.3.2. Restraints
4.3.3. Opportunities
4.4. DRO - Impact Analysis
5. Product Type: Market Size & Analysis
5.1. Overview
5.2. Antennae & Connectivity Modules
5.3. Sensors
5.4. Connectors & Switches
5.5. Lighting Systems
5.6. Others
6. Process: Market Size & Analysis
6.1. Overview
6.2. Laser Direct Structuring (LDS)
6.3. Two-Shot Molding
6.4. Film Techniques
7. Vertical : Market Size & Analysis
7.1. Overview
7.2. Telecommunications
7.3. Consumer Electronics
7.4. Automotive
7.5. Medical
7.6. Industrial
7.7. Military & Aerospace
8. Geography: Market Size & Analysis
8.1. Overview
8.2. North America (U.S., Mexico, Canada)
8.3. Europe (France, Germany, UK, Italy, Netherlands, Spain, Russia, Rest of Europe)
8.4. Asia Pacific (Japan, China, India, Australia, South East Asia, Rest of APAC)
8.5. Latin America (Brazil, Argentina)
8.6. Middle East & Africa (Saudi Arabia, UAE, South Africa, Rest of Middle East and Africa)
9. Competitive Landscape
9.1. Competitor Comparison Analysis
9.2. Market Developments
9.2.1. Mergers and Acquisitions, Legal, Awards, Partnerships
9.2.2. Product Launches and execution
10. Vendor Profiles
10.1. Molex (US)
10.1.1. Overview
10.1.2. Financial Overview
10.1.3. Product Offerings
10.1.4. Developments
10.1.5. Business Strategy
10.2. TE Connectivity (Switzerland)
10.2.1. Overview
10.2.2. Financial Overview
10.2.3. Product Offerings
10.2.4. Developments
10.2.5. Business Strategy
10.3. Amphenol Corporation (US)
10.3.1. Overview
10.3.2. Financial Overview
10.3.3. Product Offerings
10.3.4. Developments
10.3.5. Business Strategy
10.4. LPKF LASER & ELECTRONICS (GERMANY)
10.4.1. Overview
10.4.2. Financial Overview
10.4.3. Product Offerings
10.4.4. Developments
10.4.5. Business Strategy
10.5. Harting (Germany)
10.5.1. Overview
10.5.2. Financial Overview
10.5.3. Product Offerings
10.5.4. Developments
10.5.5. Business Strategy
10.6. Arlington Plating Company (US)
10.6.1. Overview
10.6.2. Financial Overview
10.6.3. Product Offerings
10.6.4. Developments
10.6.5. Business Strategy
10.7. MID Solutions (Germany)
10.7.1. Overview
10.7.2. Financial Overview
10.7.3. Product Offerings
10.7.4. Developments
10.7.5. Business Strategy
10.8. 2E Mechatronic (Germany)
10.8.1. Overview
10.8.2. Financial Overview
10.8.3. Product Offerings
10.8.4. Developments
10.8.5. Business Strategy
10.9. KYOCERA AVX (US)
10.9.1. Overview
10.9.2. Financial Overview
10.9.3. Product Offerings
10.9.4. Developments
10.9.5. Business Strategy
10.10. Taoglas (Dublin)
10.10.1. Overview
10.10.2. Financial Overview
10.10.3. Product Offerings
10.10.4. Developments
10.10.5. Business Strategy
11. Analyst Opinion
12. Annexure
12.1. Report Scope
12.2. Market Definitions
12.3. Research Methodology
12.3.1. Data Collation and In-house Estimation
12.3.2. Market Triangulation
12.3.3. Forecasting
12.4. Report Assumptions
12.5. Declarations
12.6. Stakeholders
12.7. LPKF Laser & Electronics (Germany)
12.8. Abbreviations
List of Tables
Table 1. Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 2. Molded Interconnect Device (Mid) Market Value for Antennae & Connectivity Modules, by Geography, 2021-2030 (USD Billion)
Table 3. Molded Interconnect Device (Mid) Market Value for Sensors, by Geography, 2021-2030 (USD Billion)
Table 4. Molded Interconnect Device (Mid) Market Value for Connectors & Switches, by Geography, 2021-2030 (USD Billion)
Table 5. Molded Interconnect Device (Mid) Market Value for Lighting Systems, by Geography, 2021-2030 (USD Billion)
Table 6. Molded Interconnect Device (Mid) Market Value for Others, by Geography, 2021-2030 (USD Billion)
Table 7. Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 8. Molded Interconnect Device (Mid) Market Value for Laser Direct Structuring (Lds), 2021-2030 (USD Billion)
Table 9. Molded Interconnect Device (Mid) Market Value for Two-Shot Molding, by Geography, 2021-2030 (USD Billion)
Table 10. Molded Interconnect Device (Mid) Market Value for Film Techniques, 2021-2030 (USD Billion)
Table 11. Molded Interconnect Device (Mid) Market Value, by Vertical, 2021-2030 (USD Billion)
Table 12. Molded Interconnect Device (Mid) Market Value for Telecommunications, 2021-2030 (USD Billion)
Table 13. Molded Interconnect Device (Mid) Market Value for Consumer Electronics, by Geography, 2021-2030 (USD Billion)
Table 14. Molded Interconnect Device (Mid) Market Value for Automotive, 2021-2030 (USD Billion)
Table 15. Molded Interconnect Device (Mid) Market Value for Medical, 2021-2030 (USD Billion)
Table 16. Molded Interconnect Device (Mid) Market Value for Industrial, 2021-2030 (USD Billion)
Table 17. Molded Interconnect Device (Mid) Market Value for Military & Aerospace, 2021-2030 (USD Billion)
Table 18. North America Molded Interconnect Device (Mid) Market Value, by Country, 2021-2030 (USD Billion)
Table 19. North America Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 20. North America Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 21. U.S Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 22. U.S Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 23. Canada Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 24. Canada Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 25. Mexico Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 26. Mexico Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 27. Europe Molded Interconnect Device (Mid) Market Value, by Country, 2021-2030 (USD Billion)
Table 28. Europe Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 29. Europe Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 30. Germany Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 31. Germany Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 32. U.K Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 33. U.K Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 34. France Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 35. France Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 36. Italy Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 37. Italy Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 38. Spain Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 39. Spain Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 40. RoE Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 41. RoE Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 42. Asia-Pacific Molded Interconnect Device (Mid) Market Value, by Country, 2021-2030 (USD Billion)
Table 43. Asia-Pacific Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 44. Asia-Pacific Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 45. China Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 46. China Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 47. India Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 48. India Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 49. Japan Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 50. Japan Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 51. Rest of APAC Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 52. Rest of APAC Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 53. Latin America Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 54. Latin America Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 55. Brazil Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 56. Brazil Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 57. Argentina Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 58. Argentina Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 59. Middle East and Africa Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 60. Middle East and Africa Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 61. Saudi Arabia Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 62. Saudi Arabia Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 63. UAE Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 64. UAE Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 65. Rest of Middle East and Africa Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Table 66. Rest of Middle East and Africa Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Table 67. Molex (US): Financials
Table 68. Molex (US): Products & Services
Table 69. Molex (US): Recent Developments
Table 70. Te Connectivity (Switzerland): Financials
Table 71. Te Connectivity (Switzerland): Products & Services
Table 72. Te Connectivity (Switzerland): Recent Developments
Table 73. Amphenol Corporation (US): Financials
Table 74. Amphenol Corporation (US): Products & Services
Table 75. Amphenol Corporation (US): Recent Developments
Table 76. Lpkf Laser & Electronics (Germany): Financials
Table 77. Lpkf Laser & Electronics (Germany): Products & Services
Table 78. Lpkf Laser & Electronics (Germany): Recent Developments
Table 79. Harting (Germany): Financials
Table 80. Harting (Germany): Products & Services
Table 81. Harting (Germany): Recent Developments
Table 82. Arlington Plating Company (US): Financials
Table 83. Arlington Plating Company (US): Products & Services
Table 84. Arlington Plating Company (US): Recent Developments
Table 85. Mid Solutions (Germany).: Financials
Table 86. Mid Solutions (Germany).: Products & Services
Table 87. Mid Solutions (Germany).: Recent Developments
Table 88. 2E Mechatronic (Germany): Financials
Table 89. 2E Mechatronic (Germany): Products & Services
Table 90. 2E Mechatronic (Germany): Recent Developments
Table 91. Kyocera Avx (US): Financials
Table 92. Kyocera Avx (US): Products & Services
Table 93. Kyocera Avx (US): Recent Developments
Table 94. Taoglas (Dublin): Financials
Table 95. Taoglas (Dublin): Products & Services
Table 96. Taoglas (Dublin): Recent Developments
List of Charts
Chart. 1. Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 2. Molded Interconnect Device (Mid) Market Value for Antennae & Connectivity Modules, by Geography, 2021-2030 (USD Billion)
Chart. 3. Molded Interconnect Device (Mid) Market Value for Sensors, by Geography, 2021-2030 (USD Billion)
Chart. 4. Molded Interconnect Device (Mid) Market Value for Connectors & Switches, by Geography, 2021-2030 (USD Billion)
Chart. 5. Molded Interconnect Device (Mid) Market Value for Lighting Systems, by Geography, 2021-2030 (USD Billion)
Chart. 6. Molded Interconnect Device (Mid) Market Value for Others, by Geography, 2021-2030 (USD Billion)
Chart. 7. Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 8. Molded Interconnect Device (Mid) Market Value for Laser Direct Structuring (Lds), 2021-2030 (USD Billion)
Chart. 9. Molded Interconnect Device (Mid) Market Value for Two-Shot Molding, by Geography, 2021-2030 (USD Billion)
Chart. 10. Molded Interconnect Device (Mid) Market Value for Film Techniques, 2021-2030 (USD Billion)
Chart. 11. Molded Interconnect Device (Mid) Market Value, by Vertical, 2021-2030 (USD Billion)
Chart. 12. Molded Interconnect Device (Mid) Market Value for Telecommunications, 2021-2030 (USD Billion)
Chart. 13. Molded Interconnect Device (Mid) Market Value for Consumer Electronics, by Geography, 2021-2030 (USD Billion)
Chart. 14. Molded Interconnect Device (Mid) Market Value for Automotive, 2021-2030 (USD Billion)
Chart. 15. Molded Interconnect Device (Mid) Market Value for Medical, 2021-2030 (USD Billion)
Chart. 16. Molded Interconnect Device (Mid) Market Value for Industrial, 2021-2030 (USD Billion)
Chart. 17. Molded Interconnect Device (Mid) Market Value for Military & Aerospace, 2021-2030 (USD Billion)
Chart. 18. North America Molded Interconnect Device (Mid) Market Value, by Country, 2021-2030 (USD Billion)
Chart. 19. North America Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 20. North America Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 21. U.S Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 22. U.S Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 23. Canada Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 24. Canada Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 25. Mexico Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 26. Mexico Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 27. Europe Molded Interconnect Device (Mid) Market Value, by Country, 2021-2030 (USD Billion)
Chart. 28. Europe Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 29. Europe Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 30. Germany Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 31. Germany Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 32. U.K Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 33. U.K Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 34. France Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 35. France Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 36. Italy Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 37. Italy Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 38. Spain Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 39. Spain Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 40. RoE Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 41. RoE Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 42. Asia-Pacific Molded Interconnect Device (Mid) Market Value, by Country, 2021-2030 (USD Billion)
Chart. 43. Asia-Pacific Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 44. Asia-Pacific Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 45. China Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 46. China Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 47. India Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 48. India Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 49. Japan Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 50. Japan Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 51. Rest of APAC Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 52. Rest of APAC Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 53. Latin America Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 54. Latin America Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 55. Brazil Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 56. Brazil Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 57. Argentina Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 58. Argentina Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 59. Middle East and Africa Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 60. Middle East and Africa Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 61. Saudi Arabia Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 62. Saudi Arabia Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 63. UAE Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 64. UAE Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 65. Rest of Middle East and Africa Molded Interconnect Device (Mid) Market Value, by Product Type, 2021-2030 (USD Billion)
Chart. 66. Rest of Middle East and Africa Molded Interconnect Device (Mid) Market Value, by Process, 2021-2030 (USD Billion)
Chart. 67. Molex (US): Financials
Chart. 68. Molex (US): Products & Services
Chart. 69. Molex (US): Recent Developments
Chart. 70. Te Connectivity (Switzerland): Financials
Chart. 71. Te Connectivity (Switzerland): Products & Services
Chart. 72. Te Connectivity (Switzerland): Recent Developments
Chart. 73. Amphenol Corporation (US): Financials
Chart. 74. Amphenol Corporation (US): Products & Services
Chart. 75. Amphenol Corporation (US): Recent Developments
Chart. 76. Lpkf Laser & Electronics (Germany): Financials
Chart. 77. Lpkf Laser & Electronics (Germany): Products & Services
Chart. 78. Lpkf Laser & Electronics (Germany): Recent Developments
Chart. 79. Harting (Germany): Financials
Chart. 80. Harting (Germany): Products & Services
Chart. 81. Harting (Germany): Recent Developments
Chart. 82. Arlington Plating Company (US): Financials
Chart. 83. Arlington Plating Company (US): Products & Services
Chart. 84. Arlington Plating Company (US): Recent Developments
Chart. 85. Mid Solutions (Germany).: Financials
Chart. 86. Mid Solutions (Germany).: Products & Services
Chart. 87. Mid Solutions (Germany).: Recent Developments
Chart. 88. 2E Mechatronic (Germany): Financials
Chart. 89. 2E Mechatronic (Germany): Products & Services
Chart. 90. 2E Mechatronic (Germany): Recent Developments
Chart. 91. Kyocera Avx (US): Financials
Chart. 92. Kyocera Avx (US): Products & Services
Chart. 93. Kyocera Avx (US): Recent Developments
Chart. 94. Taoglas (Dublin): Financials
Chart. 95. Taoglas (Dublin): Products & Services
Chart. 96. Taoglas (Dublin): Recent Developments

Companies Mentioned

  • Molex (US)
  • TE Connectivity (Switzerland)
  • Amphenol Corporation (US)
  • LPKF LASER & ELECTRONICS (GERMANY)
  • Harting (Germany)
  • Arlington Plating Company (US)
  • MID Solutions (Germany)
  • 2E Mechatronic (Germany)
  • KYOCERA AVX (US)
  • Taoglas (Dublin)

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