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Taiwanese IC Packaging & Testing Industry, 2Q 2021

  • ID: 5356077
  • Report
  • June 2021
  • Region: Taiwan
  • 16 Pages
  • Market Intelligence & Consulting Institute (MIC)

FEATURED COMPANIES

  • Ardentec
  • ASE
  • Chipbond
  • ChipMOS
  • FATC
  • KYEC
  • MORE

The report finds that the shipment value of the Taiwanese IC packaging and testing industry, or OSAT (Outsourced Semiconductor Assembly and Testing) reached US$4.9 billion in the first quarter of 2021 and registered over 3.2% sequential and 17.2% year-on-year growth. The Taiwanese industry’s growth in the first half of 2020 performed better than the same period of 2019, mainly attributed to order the transfer of IDMs (Integrated Device Manufacturers) amid lockdowns worldwide. 

Owing to 5G commercialization, home economy due to COVID-19, and new smartphone and game console rollouts, the industry reached US$18 billion and enjoyed over 16% year-on-year growth in 2020, up from US$15.5 billion in 2019. Catering to the customers' continued demand for notebook PCs and displays, the industry is anticipated to have witnessed 5.7% sequential and 18.6% year-on-year growth in the second quarter of 2021.

List of Topics

  • This research report presents shipment value forecast of the Taiwanese OSAT (Outsourced Semiconductor Assembly and Test) industry during the first half of 2021 and recent quarter review from 1Q 2019 to 3Q 2021 and includes shipment value breakdown by customer origin from 1Q 2019 to 1Q 2021
  • Companies surveyed in this research are major OSAT companies in Taiwan, including ASE, PTI, KYEC, Siguard, and Ardentec.
  • The content of this report is based on primary data obtained from interviews and publicly available information.
Note: Product cover images may vary from those shown

FEATURED COMPANIES

  • Ardentec
  • ASE
  • Chipbond
  • ChipMOS
  • FATC
  • KYEC
  • MORE
  • Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2019 - 3Q 2021
  • Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 1Q 2019 - 3Q 2021
  • Taiwanese IC Packaging Industry Shipment Value, 1Q 2019 - 3Q 2021
  • Taiwanese IC Testing Industry Shipment Value, 1Q 2019 - 3Q 2021
  • Taiwanese IC Packaging Industry Shipment Value Rankings, 1Q 2019 - 1Q 2021
  • Taiwanese IC Packaging Industry Shipment Value by Vendor Tier, 1Q 2019 - 1Q 2021
  • Taiwanese IC Testing Industry's Shipment Value Rankings, 1Q 2019 - 1Q 2021
  • Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 1Q 2019 - 1Q 2021
  • Taiwanese IC Packaging Industry Shipment Value by Customer Origin, 1Q 2019 - 1Q 2021
  • Taiwanese IC Packaging Industry Shipment Value Share by Customer Origin, 1Q 2019 - 1Q 2021
  • Taiwanese IC Testing Industry Shipment Value by Customer Origin, 1Q 2019 - 1Q 2021
  • Taiwanese IC Testing Industry Shipment Value Share by Customer Origin, 1Q 2019 - 1Q 2021
  • Exchange Rate, 1Q 2019 - 1Q 2021
  • Research Scope & Definitions
Note: Product cover images may vary from those shown
  • Ardentec
  • ASE
  • Chipbond
  • ChipMOS
  • FATC
  • KYEC
  • OSE
  • PTI
  • Sigurd
  • Walton
Note: Product cover images may vary from those shown

Primary research with a holistic, cross-domain approach

The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.

Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:

Method

  • Component supplier interviews
  • System supplier interviews
  • User interviews
  • Channel interviews
  • IPO interviews
  • Focus groups
  • Consumer surveys
  • Production databases
  • Financial data
  • Custom databases

Methodology

  • Technology forecasting and assessment
  • Product assessment and selection
  • Product life cycles
  • Added value analysis
  • Market trends
  • Scenario analysis
  • Competitor analysis

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