Molded Interconnect Device (MID) Market Report 2026

The molded interconnect device (mid) market size has grown rapidly in recent years. It will grow from $2 billion in 2025 to $2.31 billion in 2026 at a compound annual growth rate (CAGR) of 15.5%. The growth in the historic period can be attributed to growth in miniaturized electronics, early adoption in automotive and consumer devices, reliance on traditional wiring and connectors, expansion in industrial sensor packaging, increasing use of compact electromechanical components.

The molded interconnect device (mid) market size is expected to see rapid growth in the next few years. It will grow to $4.08 billion in 2030 at a compound annual growth rate (CAGR) of 15.3%. The growth in the forecast period can be attributed to rising demand for high-density interconnect solutions, growth in wearable and medical device electronics, expansion of antenna and rf module integration, increasing adoption in advanced automotive systems, development of low-cost precision molded circuitry. Major trends in the forecast period include adoption of intelligent 3d electromechanical integration, advancement of automated lds and two-shot molding processes, development of smart connected mid components, expansion of digitally optimized manufacturing workflows, integration of sustainable lightweight electronic structures.

The growing demand for IoT devices is expected to drive the growth of the molded interconnect devices market going forward. IoT devices refer to the billions of physical objects connected to the internet, all of which collect and exchange data with other devices and systems online. The demand for IoT devices is rising due to the increasing need for connectivity and automation in homes and industries. Molded interconnect devices (MID) are used in IoT devices to integrate electronic circuits directly onto 3D plastic structures, enabling compact and efficient designs. For example, in September 2024, according to IoT Analytics, a Germany-based provider of strategic business intelligence for IoT, the global number of connected IoT devices reached 16.6 billion at the end of 2023, representing a 15% year-on-year increase over 2022. Therefore, the growing demand for IoT devices is driving the molded interconnect devices market.

Major companies operating in the molded interconnect device market are focusing on pioneering products such as light antennas to bolster market revenues. Light antennas represent a breakthrough in wireless communications, being smaller than a US dime and pivotal in enabling widespread LiFi (Light Fidelity) usage in smartphones and connected devices. As unveiled in February 2023 by pureLiFi Limited, the LiFi Light Antenna is engineered for seamless integration, optimizing performance, size, cost, and production needs. Leveraging the light spectrum, LiFi surpasses conventional technologies like WiFi and 5G in speed, reliability, and security, offering scalability for widespread adoption in smartphones and connected devices.

In October 2023, TE Connectivity Ltd., a Switzerland-based provider of sensors, connectors, and electronic components, acquired Schaffner Holding AG for an undisclosed amount. Through this acquisition, TE Connectivity aims to strengthen its product portfolio with Schaffner’s electromagnetic solutions, particularly in the industrial and automotive markets, and to expand its presence in key electrification and power-quality segments. Schaffner Holding AG is a Switzerland-based provider of EMC filter solutions, harmonic filters, and electromagnetic components for molded interconnect devices used in industrial and mobility applications.

Major companies operating in the molded interconnect device (mid) market are Molex LLC, TE Connectivity Ltd., Amphenol Corporation, LPKF Laser & Electronics AG, 2E mechatronic GmbH & Co. KG, Harting Technologiegruppe, Arlington Plating Company, MID Solutions LLC, MacDermid Inc., JOHNAN Corporation, TactoTek Oy, Axon' Cable S.A.S, S2P Solutions, Suzhou Cicor Technology Co. Ltd, Chogori Technology Co. Ltd., Mitsubishi Engineering-Plastics Corporation, Galtronics Corporation Ltd., RTP Company, BASF SE, EMS-Chemie Holding AG, Ensinger GmbH, Zeon Corporation, SelectConnect Technologies, Multiple Dimensions AG, Cicor Group, Tesa SE, Yomura Technologies Inc., T-Ink Inc., ODU GmbH & Co. KG.

Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report’s Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.

Tariffs have influenced the molded interconnect device market by raising costs for imported polymers, metal plating materials, semiconductor components, and precision molding equipment. Automotive, consumer electronics, industrial, and healthcare sectors in Asia-Pacific, Europe, and North America are experiencing higher production costs and longer supply cycles. Nevertheless, tariffs are driving regionalization of MID manufacturing, encouraging local sourcing of materials, and stimulating innovation in cost-efficient electromechanical integration technologies to enhance competitiveness.

The molded interconnected device market research report is one of a series of new reports that provides molded interconnected device market statistics, including molded interconnected device industry global market size, regional shares, competitors with a molded interconnected device market share, detailed molded interconnected device market segments, market trends and opportunities, and any further data you may need to thrive in the molded interconnected device industry. This molded interconnected device market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

Molded Interconnect Devices (MIDs) represent sophisticated electromechanical components integrating mechanical and electrical engineering principles in three dimensions. They amalgamate traditional product interfaces - circuit boards, housing, connectors, and wiring - into a singular, compact, and fully functional unit. MIDs typify a production method utilizing selectively plated plastic pieces.

The primary processes employed in Molded Interconnect Devices encompass Laser Direct Structuring (LDS), Two-Shot Molding, and other relevant techniques. Laser Direct Structuring stands out as an environmentally friendly, precise, and pioneering manufacturing method for three-dimensional molded connector devices. These products include antenna and connectivity modules, connectors and switches, sensors, lighting, and other relevant items. Applications span across automotive, consumer products, healthcare, industrial, military and aerospace, as well as telecommunication and computing sectors.Asia-Pacific was the largest region in the molded interconnect device (MID) market share in 2025. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the molded interconnect device (mid) market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the molded interconnect device (mid) market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The molded interconnect device market consists of sales of metal spraying and film techniques. Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

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