Development of the China IC Packaging and Testing Industry and Key Players

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Report
17 Pages
September 2023
Region: China
Market Intelligence & Consulting Institute (MIC)
ID: 5880044

According to statistics from the China Semiconductor Industry Association (CSIA), the sales revenue of China's semiconductor industry in 2022 amounted to 1.2 trillion RMB (US$171.4 billion; US$=7 RMB). Among them, the proportions of IC design industry, IC manufacturing industry, and IC packaging and testing industry in the total sales revenue were 43%, 32%, and 25%, respectively. The IC packaging and testing industry was one of the early semiconductor sub-industries to be developed in China. Before 2016, China's IC packaging and testing industry consistently held a leading position in the semiconductor industry. However, due to the rapid expansion of the IC design and wafer foundry industries, the proportion of the IC packaging and testing industry in China's semiconductor industry revenue has decreased. This report provides an overview of the development of the IC packaging and testing industry in China, focusing on aspects such as market size, changes in industry structure, and the dynamics of major players.

1. Development of China IC Packaging and Testing Industry

1.1 Market Size and Recent Changes in China's IC Packaging and Testing Industry
1.2 Regional Distribution of IC Packaging and Testing Industry Players in China

2. Development of major IC Packaging and Testing Players in China

2.1 Ranking of the Top-10 Chinese IC Packaging and Testing Companies
2.2 Recent Performance of the Top-3 Chinese IC Packaging and Testing Companies
2.2.1 JCET
2.2.2 Tongfu Microelectronics
2.2.3 Huatian Technology

3. Outlook for the Industry

3.1 Effects of National Integrated Circuit Industry Investment Fund
3.2 Impact of US-China Conflict and Decoupling from China
3.3 China Shifting Focus to Automotive Semiconductors Following Obstacles in Advanced Process Technology

AppendixList of Companies

List of Tables

Table 1 Ranking of the Top 10 Chinese IC Packaging and Testing Companies in 2022

List of Figures

Figure 1 Chinese IC Packaging and Testing Shipment Value, 2018-2022
Figure 2 Regional Distribution of IC Packaging and Testing Brands in China
Figure 3 Financial Information of JCET, 2018-2022
Figure 4 Revenue of JCET by Product Application, 2021-2022
Figure 5 Financial Information of Tongfu Microelectronics, 2018-2022
Figure 6 Financial Information of Huatian Technology, 2018-2022

Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

AMD
Amkor
Ardentec Technology
ASE Group
ASEN Semiconductors
Bosch
Broadcom
China Wafer Level
Chipmore Technology
Chrysler
FlipChip International
Ford
Forehope Electronic
General Motors
Hana Microelectronics
Hua Hong Semiconductor
Huatian Technology
Infineon
Intel
JCET
Kore Semiconductor
KYEC
Lingsen Precision
Micron
Nepes
NXP
Onsemi
Payton Technology
Powertech Technology
Qorvo
Samsung
SFA
Sigurd Microelectronics
Siliconware
SJ Semiconductor
SK Hynix
Skyworks
SMIC
Sony
STATS ChipPAC
STMicro
Texas Instruments
Tongfu Electronics
Unimos Microelectronics
Unisem
Unitech Holdings
UTAC
Walton Advanced Engineering
Wise Road Capital
Xilinx
YTEC

Methodology

Primary research with a holistic, cross-domain approach

The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.

Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:

Method

Component supplier interviews
System supplier interviews
User interviews
Channel interviews
IPO interviews
Focus groups
Consumer surveys
Production databases
Financial data
Custom databases

Methodology

Technology forecasting and assessment
Product assessment and selection
Product life cycles
Added value analysis
Market trends
Scenario analysis
Competitor analysis

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Table of Contents

Companies Mentioned (Partial List)

Methodology

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