Silicon Carbide (SIC) Chemical Mechanical Planarization (CMP) Pads And Slurry Market Global Report 2026

The silicon carbide (sic) chemical mechanical planarization (cmp) pads and slurry market size has grown rapidly in recent years. It will grow from $0.64 billion in 2025 to $0.71 billion in 2026 at a compound annual growth rate (CAGR) of 12.1%. The growth in the historic period can be attributed to increasing demand for SiC wafer products, growing adoption of power semiconductor technologies, rising requirement for high-quality wafer surfaces, increasing production of SiC semiconductors, expanding utilization of SiC devices across power electronics applications.

The silicon carbide (sic) chemical mechanical planarization (cmp) pads and slurry market size is expected to see rapid growth in the next few years. It will grow to $1.11 billion in 2030 at a compound annual growth rate (CAGR) of 11.6%. The growth in the forecast period can be attributed to increasing demand for advanced silicon carbide (SiC) power devices, growing adoption of electric vehicles, rising need for high-precision wafer processing, expanding semiconductor manufacturing capacity, and increasing demand for high-efficiency power electronics. Major trends in the forecast period include growing adoption of high-precision SiC wafer polishing, development of advanced chemical mechanical polishing (CMP) pad materials, optimization of abrasive slurry formulations, increasing emphasis on reducing wafer defects, and advancements in surface finishing capabilities.

The growth of electric vehicles (EVs) is expected to propel the growth of the silicon carbide (SiC) chemical mechanical planarization (CMP) pads and slurry market going forward. Electric vehicles are vehicles powered primarily by electric motors using energy stored in batteries, and their adoption is increasing due to sustainability goals, lower emissions, and advancements in battery technology. Electric vehicle adoption is increasing due to lower operating costs, as EVs require less maintenance and use electricity, which is generally cheaper than gasoline or diesel, reducing overall vehicle ownership expenses. Electric vehicles (EVs) are driving the rapid adoption of silicon carbide (SiC) power semiconductors by enabling higher efficiency, faster charging, and enhanced performance, creating a growing need for advanced SiC CMP pads and slurries to achieve precise wafer processing and high-quality semiconductor production. For instance, in January 2025, according to Cox Automotive, a US-based system software company, electric vehicle sales climbed to 102,243 units, reflecting strong market growth with a 29.9% year-over-year increase. Therefore, the growth of electric vehicles (EVs) is driving the growth of the silicon carbide (SiC) chemical mechanical planarization (CMP) pads and slurry market.

Key companies operating in the silicon carbide (SiC) chemical mechanical planarization (CMP) pads and slurry market are focusing on developing innovative products such as advanced CMP polishing pads to enhance wafer surface quality, defect control, process stability, and manufacturing efficiency in next-generation semiconductor production. Advanced CMP polishing pads are specialized consumable materials used in chemical mechanical planarization processes to precisely smooth and flatten semiconductor wafer surfaces through controlled mechanical polishing and chemical interactions, enabling improved precision and reliability compared with conventional polishing solutions. For example, in June 2026, Qnity Electronics Inc., a US-based semiconductor technology solutions company, launched Optivision Max CMP Pad Family, an advanced polishing pad solution designed to support next-generation semiconductor manufacturing. The Optivision Max CMP pads are engineered to provide improved defect control, extended pad lifetime, and enhanced process efficiency during critical CMP steps. The product family supports advanced semiconductor nodes and complex device architectures by improving surface quality, process stability, and manufacturing reliability. The first commercial offering, Optivision Max 8300, is available in multiple configurations, including integrated windows for endpoint detection, allowing manufacturers to achieve tighter process control and higher wafer yields.

In August 2024, Entegris Inc., a US-based provider of advanced materials and process solutions for semiconductor manufacturing, partnered with onsemi to provide advanced chemical mechanical planarization (CMP) solutions for silicon carbide (SiC) semiconductor applications. Under this partnership, Entegris Inc. will supply onsemi with co-optimized chemical mechanical planarization (CMP) solutions designed for silicon carbide (SiC) applications. Through this collaboration, Entegris, Inc. and onsemi aim to improve SiC wafer manufacturing processes, increase semiconductor production efficiency, enable high-volume manufacturing with fewer defects, and meet the rising demand for SiC-based technologies used in electric vehicles, renewable energy, power electronics, and advanced computing. Onsemi is a US-based semiconductor company focused on intelligent power management, silicon carbide technologies, and energy-efficient semiconductor solutions.

Major companies operating in the silicon carbide (SIC) chemical mechanical planarization (CMP) pads and slurry market are 3M Company, AGC Inc., Sanwa Kenma Co. Ltd., Entegris Inc., Vibrantz Technologies Inc., Anji Microelectronics Technology (Shanghai) Co. Ltd., Fujimi Incorporated, IVT Co. Ltd., Fujibo Holdings Inc., Beijing Grish Hitech Co. Ltd., Baikowski S.A., Universal Photonics Inc., Spartan Felt Company, KC Tech Co. Ltd., Ace Nanochem Co. Ltd., SPS International Ltd., Hubei Dinglong Co. Ltd.

Asia-Pacific was the dominant region in the silicon carbide (SIC) chemical mechanical planarization (CMP) pads and slurry market in 2025. Asia-Pacific is expected to be the rapidly growing region in the forecast period. The regions covered in the silicon carbide (SIC) chemical mechanical planarization (CMP) pads and slurry market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the silicon carbide (SIC) chemical mechanical planarization (CMP) pads and slurry market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

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