Photonic integrated circuit (PIC) is an optical chip which accommodates multiple photonic functions and is being developed as an alternative for electronic integrated circuits. Their capability to transmit data in optical medium unlike electronic ICs make them effective medium for communication in telecom and datacentre sectors. In case of sensors, light is an effective medium for material detection. PICs can be leveraged for sensing applications as well. Research and development toward improving the performance parameters of PICs and to determine new materials apart III-V materials is an on-going process. PICs are being developed in order to support the rapid advancements in technology such as wireless charging and energy conversion.
This technology and innovation research report offers insights on recent innovations in PIC technology. The research report focuses mainly on the innovations in the value chain of PICs, i.e., developments pertaining to materials, fabrication and integration of PICs. This research report also offers insights on applications that might evolve in the next 5 to 6 years.
The report captures the following modules:
- Technology landscape
- Applications assessment
- Factors influencing development and adoption–Key drivers and challenges
- Global trends and innovation indicators
- Breadth of applications impacted
- Technology and application roadmaps showing the future prospect of transistors
- Strategic insights about market and emerging trends
