Atomic Layer Deposition (ALD) is a thin-film deposition technique used in the semiconductor industry to create thin films of material on a substrate. ALD is a self-limiting process, meaning that each cycle of the process adds a single layer of material to the substrate. This makes it ideal for creating thin films with precise thickness control. ALD is also used to create high-k dielectric layers, which are essential for modern semiconductor devices. ALD is also used to create metal oxide layers, which are used for passivation and as diffusion barriers.
ALD is used in a variety of semiconductor applications, including memory devices, logic devices, and optoelectronic devices. ALD is also used to create thin films for advanced packaging applications, such as 3D integration and wafer-level packaging.
Companies in the ALD market include Applied Materials, ASM International, Lam Research, Tokyo Electron, Oxford Instruments, and Veeco Instruments. Show Less Read more