Results for tag: "Chemical Mechanical Planarization Equipment"

Chemical Mechanical Planarization (CMP) Equipment is a type of semiconductor fabrication equipment used to create a flat, smooth surface on a wafer. It is used to remove material from the surface of the wafer, such as oxide layers, and to planarize the surface. CMP equipment is used in the fabrication of integrated circuits, microprocessors, and other semiconductor devices. The process involves the use of a slurry, which is a mixture of abrasive particles suspended in a liquid, and a polishing pad. The slurry is applied to the wafer and the pad is used to move the slurry across the surface of the wafer. The abrasive particles in the slurry remove material from the surface of the wafer, while the polishing pad smoothes the surface. CMP equipment is an important part of the semiconductor fabrication process, as it is used to create the flat, smooth surfaces necessary for the successful fabrication of integrated circuits and other semiconductor devices. Some companies in the CMP Equipment market include Applied Materials, Lam Research, Tokyo Electron, KLA Corporation, and Disco Corporation. Show Less Read more