Results for tag: "Deep Reactive Ion Etching"

Deep Reactive Ion Etching (DRIE) is a type of etching process used in the semiconductor industry to create high-aspect-ratio features in silicon and other materials. It is a dry etching process that uses a combination of physical sputtering and chemical etching to create features with vertical sidewalls and aspect ratios of up to 100:1. DRIE is used in the fabrication of microelectromechanical systems (MEMS) and other micro-scale devices, as well as in the production of integrated circuits. DRIE is a critical process in the semiconductor industry, as it enables the fabrication of high-aspect-ratio features that are not possible with other etching techniques. It is also used to create cavities and trenches in silicon and other materials, which are used in the production of MEMS and other micro-scale devices. Some of the companies in the DRIE market include Lam Research, Applied Materials, Tokyo Electron, Oxford Instruments, and Plasma-Therm. Show Less Read more