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Results for tag: "IC Packaging"

Taiwan IC Packaging and Testing Industry, 2Q 2023 - Product Thumbnail Image

Taiwan IC Packaging and Testing Industry, 2Q 2023

  • Report
  • June 2023
  • 8 Pages
  • Taiwan
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Taiwanese IC Packaging & Testing Industry, 3Q 2021 - Product Thumbnail Image

Taiwanese IC Packaging & Testing Industry, 3Q 2021

  • Report
  • September 2021
  • 16 Pages
  • Taiwan
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Recap and Outlook of Worldwide OSAT Industry in 2020  - Product Thumbnail Image

Recap and Outlook of Worldwide OSAT Industry in 2020

  • Report
  • May 2020
  • 24 Pages
  • Global
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The IC Packaging market is a segment of the semiconductor industry that involves the design, manufacture, and sale of integrated circuit (IC) packages. IC packages are used to protect and connect ICs to other components in a system. They are also used to provide electrical and thermal performance, as well as to reduce the size of the system. The IC Packaging market is driven by the increasing demand for miniaturization and higher performance of electronic devices. The market is also driven by the increasing demand for consumer electronics, such as smartphones, tablets, and laptops. The IC Packaging market is highly competitive, with a number of companies offering a wide range of products. Some of the major players in the market include Amkor Technology, ASE Technology, STATS ChipPAC, and Jiangsu Changjiang Electronics Technology. Other prominent players include Advanced Semiconductor Engineering, Kinsus Interconnect Technology, and Siliconware Precision Industries. Show Less Read more