Results for tag: "System On Package"

System on Package (SOP) is a type of semiconductor packaging technology that integrates multiple components, such as processors, memory, and other components, into a single package. This technology is used to reduce the size and complexity of electronic systems, while also providing improved performance and reliability. SOPs are typically used in mobile devices, such as smartphones and tablets, as well as in automotive, industrial, and medical applications. SOPs are typically composed of a substrate, such as a printed circuit board (PCB), and a package, such as a ball grid array (BGA). The substrate is used to provide electrical connections between the components, while the package is used to protect the components from environmental conditions. The components are then connected to the substrate using a variety of techniques, such as wire bonding, flip chip, and solder reflow. SOPs are becoming increasingly popular due to their ability to reduce the size and complexity of electronic systems. This technology is also becoming more cost-effective, as it eliminates the need for multiple components and reduces the number of assembly steps. Some of the major companies in the SOP market include Intel, Samsung, Qualcomm, and Texas Instruments. Show Less Read more