Wire bonding is a process used in the semiconductor industry to connect two or more electrical components together. It is a critical step in the fabrication of integrated circuits and other semiconductor devices. The process involves the use of a thin wire, usually made of gold or aluminum, to connect the components. The wire is then bonded to the components using a combination of heat and pressure. The process is highly precise and requires specialized equipment and expertise. Wire bonding is used in a variety of applications, including the manufacture of microprocessors, memory chips, and other semiconductor devices. It is also used in the production of solar cells, medical devices, and other electronic components. The process is used to create reliable and durable connections between components, and is often used in high-reliability applications. The wire bonding market is highly competitive, with a number of companies offering a range of products and services. Some of the major players in the market include Kulicke & Soffa, Palomar Technologies, and Nordson MARCH. Show Less Read more
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