Global Molded Interconnect Device Market by Product Type (Antennae & Connectivity Modules, Connectors & Switches, Lighting Systems), Process (Film Techniques, Laser Direct Structuring, Two-Shot Molding), Vertical - Forecast 2024-2030- Product Image

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Global Molded Interconnect Device Market by Product Type (Antennae & Connectivity Modules, Connectors & Switches, Lighting Systems), Process (Film Techniques, Laser Direct Structuring, Two-Shot Molding), Vertical - Forecast 2024-2030

Report
185 Pages
March 2024
Region: Global
360iResearch™
ID: 5666216

UP TO €851EUR$875USD£729GBP OFF until Dec 31^st 2024

The Molded Interconnect Device Market size was estimated at USD 2.44 billion in 2023, USD 2.78 billion in 2024, and is expected to grow at a CAGR of 14.33% to reach USD 6.24 billion by 2030.

FPNV Positioning Matrix

The FPNV Positioning Matrix is pivotal in evaluating the Molded Interconnect Device Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).

Market Share Analysis

The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Molded Interconnect Device Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.

Key Company Profiles

The report delves into recent significant developments in the Molded Interconnect Device Market, highlighting leading vendors and their innovative profiles. These include Amphenol Corporation, Arlington Plating Company, GALTRONICS Corporation Limited, Harting Group, KYOCERA AVX Components Corporation, LPKF Laser & Electronics SE, MID Solutions GmbH, Molex LLC, RTP Company, SUZHOU CICOR TECHNOLOGY CO. LTD, Taoglas, TE Connectivity, Teprosa GmbH, Tongda Group, and Yomura Technologies Inc.

Market Segmentation & Coverage

This research report categorizes the Molded Interconnect Device Market to forecast the revenues and analyze trends in each of the following sub-markets:

Product Type
- Antennae & Connectivity Modules
- Connectors & Switches
- Lighting Systems
- Sensors
Process
- Film Techniques
- Laser Direct Structuring
- Two-Shot Molding
Vertical
- Automotive
- Consumer Electronics
- Industrial
- Medical
- Military & Aerospace
- Telecommunications

Region
- Americas
  - Argentina
  - Brazil
  - Canada
  - Mexico
  - United States
    - California
    - Florida
    - Illinois
    - New York
    - Ohio
    - Pennsylvania
    - Texas
- Asia-Pacific
  - Australia
  - China
  - India
  - Indonesia
  - Japan
  - Malaysia
  - Philippines
  - Singapore
  - South Korea
  - Taiwan
  - Thailand
  - Vietnam
- Europe, Middle East & Africa
  - Denmark
  - Egypt
  - Finland
  - France
  - Germany
  - Israel
  - Italy
  - Netherlands
  - Nigeria
  - Norway
  - Poland
  - Qatar
  - Russia
  - Saudi Arabia
  - South Africa
  - Spain
  - Sweden
  - Switzerland
  - Turkey
  - United Arab Emirates
  - United Kingdom

The report offers valuable insights on the following aspects:

Market Penetration: It presents comprehensive information on the market provided by key players.
Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.
Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.
Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.
Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.

The report addresses key questions such as:

What is the market size and forecast of the Molded Interconnect Device Market?
Which products, segments, applications, and areas should one consider investing in over the forecast period in the Molded Interconnect Device Market?
What are the technology trends and regulatory frameworks in the Molded Interconnect Device Market?
What is the market share of the leading vendors in the Molded Interconnect Device Market?
Which modes and strategic moves are suitable for entering the Molded Interconnect Device Market?

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1. Preface

1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders

2. Research Methodology

2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

4.1. Introduction
4.2. Molded Interconnect Device Market, by Region

5. Market Insights

5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Rising need in healthcare and consumer electronics industry
5.1.1.2. Wide applications in automotive industry
5.1.1.3. High use of laser direct structuring
5.1.2. Restraints
5.1.2.1. Concerns pertaining to raw materials cost
5.1.3. Opportunities
5.1.3.1. Technological advancements in molded interconnect devices
5.1.3.2. Investments in expanding IIoT ecosystem
5.1.4. Challenges
5.1.4.1. Incompatibility issues of molded interconnect devices
5.2. Market Segmentation Analysis
5.3. Market Trend Analysis
5.4. Cumulative Impact of High Inflation
5.5. Porter’s Five Forces Analysis
5.5.1. Threat of New Entrants
5.5.2. Threat of Substitutes
5.5.3. Bargaining Power of Customers
5.5.4. Bargaining Power of Suppliers
5.5.5. Industry Rivalry
5.6. Value Chain & Critical Path Analysis
5.7. Regulatory Framework

6. Molded Interconnect Device Market, by Product Type

6.1. Introduction
6.2. Antennae & Connectivity Modules
6.3. Connectors & Switches
6.4. Lighting Systems
6.5. Sensors

7. Molded Interconnect Device Market, by Process

7.1. Introduction
7.2. Film Techniques
7.3. Laser Direct Structuring
7.4. Two-Shot Molding

8. Molded Interconnect Device Market, by Vertical

8.1. Introduction
8.2. Automotive
8.3. Consumer Electronics
8.4. Industrial
8.5. Medical
8.6. Military & Aerospace
8.7. Telecommunications

9. Americas Molded Interconnect Device Market

9.1. Introduction
9.2. Argentina
9.3. Brazil
9.4. Canada
9.5. Mexico
9.6. United States

10. Asia-Pacific Molded Interconnect Device Market

10.1. Introduction
10.2. Australia
10.3. China
10.4. India
10.5. Indonesia
10.6. Japan
10.7. Malaysia
10.8. Philippines
10.9. Singapore
10.10. South Korea
10.11. Taiwan
10.12. Thailand
10.13. Vietnam

11. Europe, Middle East & Africa Molded Interconnect Device Market

11.1. Introduction
11.2. Denmark
11.3. Egypt
11.4. Finland
11.5. France
11.6. Germany
11.7. Israel
11.8. Italy
11.9. Netherlands
11.10. Nigeria
11.11. Norway
11.12. Poland
11.13. Qatar
11.14. Russia
11.15. Saudi Arabia
11.16. South Africa
11.17. Spain
11.18. Sweden
11.19. Switzerland
11.20. Turkey
11.21. United Arab Emirates
11.22. United Kingdom

12. Competitive Landscape

12.1. FPNV Positioning Matrix
12.2. Market Share Analysis, By Key Player
12.3. Competitive Scenario Analysis, By Key Player

13. Competitive Portfolio

13.1. Key Company Profiles
13.1.1. Amphenol Corporation
13.1.2. Arlington Plating Company
13.1.3. GALTRONICS Corporation Limited
13.1.4. Harting Group
13.1.5. KYOCERA AVX Components Corporation
13.1.6. LPKF Laser & Electronics SE
13.1.7. MID Solutions GmbH
13.1.8. Molex LLC
13.1.9. RTP Company
13.1.10. SUZHOU CICOR TECHNOLOGY CO. LTD
13.1.11. Taoglas
13.1.12. TE Connectivity
13.1.13. Teprosa GmbH
13.1.14. Tongda Group
13.1.15. Yomura Technologies Inc.
13.2. Key Product Portfolio

14. Appendix

14.1. Discussion Guide
14.2. License & Pricing

List of Figures

FIGURE 1. MOLDED INTERCONNECT DEVICE MARKET RESEARCH PROCESS
FIGURE 2. MOLDED INTERCONNECT DEVICE MARKET SIZE, 2023 VS 2030
FIGURE 3. MOLDED INTERCONNECT DEVICE MARKET SIZE, 2018-2030 (USD MILLION)
FIGURE 4. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY REGION, 2023 VS 2030 (%)
FIGURE 5. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 6. MOLDED INTERCONNECT DEVICE MARKET DYNAMICS
FIGURE 7. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2023 VS 2030 (%)
FIGURE 8. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 9. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2023 VS 2030 (%)
FIGURE 10. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 11. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2023 VS 2030 (%)
FIGURE 12. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 13. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
FIGURE 14. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 15. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY STATE, 2023 VS 2030 (%)
FIGURE 16. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 17. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
FIGURE 18. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 19. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
FIGURE 20. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 21. MOLDED INTERCONNECT DEVICE MARKET, FPNV POSITIONING MATRIX, 2023
FIGURE 22. MOLDED INTERCONNECT DEVICE MARKET SHARE, BY KEY PLAYER, 2023

List of Tables

TABLE 1. MOLDED INTERCONNECT DEVICE MARKET SEGMENTATION & COVERAGE
TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
TABLE 3. MOLDED INTERCONNECT DEVICE MARKET SIZE, 2018-2030 (USD MILLION)
TABLE 4. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
TABLE 5. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 6. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY ANTENNAE & CONNECTIVITY MODULES, BY REGION, 2018-2030 (USD MILLION)
TABLE 7. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY CONNECTORS & SWITCHES, BY REGION, 2018-2030 (USD MILLION)
TABLE 8. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY LIGHTING SYSTEMS, BY REGION, 2018-2030 (USD MILLION)
TABLE 9. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY SENSORS, BY REGION, 2018-2030 (USD MILLION)
TABLE 10. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 11. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY FILM TECHNIQUES, BY REGION, 2018-2030 (USD MILLION)
TABLE 12. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY LASER DIRECT STRUCTURING, BY REGION, 2018-2030 (USD MILLION)
TABLE 13. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY TWO-SHOT MOLDING, BY REGION, 2018-2030 (USD MILLION)
TABLE 14. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 15. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2030 (USD MILLION)
TABLE 16. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
TABLE 17. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY INDUSTRIAL, BY REGION, 2018-2030 (USD MILLION)
TABLE 18. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY MEDICAL, BY REGION, 2018-2030 (USD MILLION)
TABLE 19. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY MILITARY & AEROSPACE, BY REGION, 2018-2030 (USD MILLION)
TABLE 20. MOLDED INTERCONNECT DEVICE MARKET SIZE, BY TELECOMMUNICATIONS, BY REGION, 2018-2030 (USD MILLION)
TABLE 21. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 22. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 23. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 24. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
TABLE 25. ARGENTINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 26. ARGENTINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 27. ARGENTINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 28. BRAZIL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 29. BRAZIL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 30. BRAZIL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 31. CANADA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 32. CANADA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 33. CANADA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 34. MEXICO MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 35. MEXICO MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 36. MEXICO MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 37. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 38. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 39. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 40. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
TABLE 41. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 42. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 43. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 44. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
TABLE 45. AUSTRALIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 46. AUSTRALIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 47. AUSTRALIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 48. CHINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 49. CHINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 50. CHINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 51. INDIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 52. INDIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 53. INDIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 54. INDONESIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 55. INDONESIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 56. INDONESIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 57. JAPAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 58. JAPAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 59. JAPAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 60. MALAYSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 61. MALAYSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 62. MALAYSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 63. PHILIPPINES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 64. PHILIPPINES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 65. PHILIPPINES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 66. SINGAPORE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 67. SINGAPORE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 68. SINGAPORE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 69. SOUTH KOREA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 70. SOUTH KOREA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 71. SOUTH KOREA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 72. TAIWAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 73. TAIWAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 74. TAIWAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 75. THAILAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 76. THAILAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 77. THAILAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 78. VIETNAM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 79. VIETNAM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 80. VIETNAM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 81. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 82. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 83. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 84. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
TABLE 85. DENMARK MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 86. DENMARK MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 87. DENMARK MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 88. EGYPT MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 89. EGYPT MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 90. EGYPT MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 91. FINLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 92. FINLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 93. FINLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 94. FRANCE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 95. FRANCE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 96. FRANCE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 97. GERMANY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 98. GERMANY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 99. GERMANY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 100. ISRAEL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 101. ISRAEL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 102. ISRAEL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 103. ITALY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 104. ITALY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 105. ITALY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 106. NETHERLANDS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 107. NETHERLANDS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 108. NETHERLANDS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 109. NIGERIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 110. NIGERIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 111. NIGERIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 112. NORWAY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 113. NORWAY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 114. NORWAY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 115. POLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 116. POLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 117. POLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 118. QATAR MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 119. QATAR MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 120. QATAR MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 121. RUSSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 122. RUSSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 123. RUSSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 124. SAUDI ARABIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 125. SAUDI ARABIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 126. SAUDI ARABIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 127. SOUTH AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 128. SOUTH AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 129. SOUTH AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 130. SPAIN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 131. SPAIN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 132. SPAIN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 133. SWEDEN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 134. SWEDEN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 135. SWEDEN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 136. SWITZERLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 137. SWITZERLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 138. SWITZERLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 139. TURKEY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 140. TURKEY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 141. TURKEY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 142. UNITED ARAB EMIRATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 143. UNITED ARAB EMIRATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 144. UNITED ARAB EMIRATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 145. UNITED KINGDOM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
TABLE 146. UNITED KINGDOM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
TABLE 147. UNITED KINGDOM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
TABLE 148. MOLDED INTERCONNECT DEVICE MARKET, FPNV POSITIONING MATRIX, 2023
TABLE 149. MOLDED INTERCONNECT DEVICE MARKET SHARE, BY KEY PLAYER, 2023
TABLE 150. MOLDED INTERCONNECT DEVICE MARKET LICENSE & PRICING

Companies Mentioned

Amphenol Corporation
Arlington Plating Company
GALTRONICS Corporation Limited
Harting Group
KYOCERA AVX Components Corporation
LPKF Laser & Electronics SE
MID Solutions GmbH
Molex LLC
RTP Company
SUZHOU CICOR TECHNOLOGY CO. LTD
Taoglas
TE Connectivity
Teprosa GmbH
Tongda Group
Yomura Technologies Inc.

Methodology

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Table Information

Report Attribute	Details
No. of Pages	185
Published	March 2024
Forecast Period	2024 - 2030
Estimated Market Value ( USD ) in 2024	$ 2.78 Billion
Forecasted Market Value ( USD ) by 2030	$ 6.24 Billion
Compound Annual Growth Rate	14.3%
Regions Covered	Global
No. of Companies Mentioned	15

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FPNV Positioning Matrix

Market Share Analysis

Key Company Profiles

Market Segmentation & Coverage

The report offers valuable insights on the following aspects:

The report addresses key questions such as:

Table of Contents

Companies Mentioned

Methodology

Table Information

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