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Results for tag: "Semiconductor Packaging"

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Embedded Die Packaging Market Outlook 2037 - Product Thumbnail Image

Embedded Die Packaging Market Outlook 2037

  • Report
  • December 2024
  • 336 Pages
  • Global
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Flip Chip Ball Grid Array Market in United States - Product Thumbnail Image

Flip Chip Ball Grid Array Market in United States

  • Report
  • August 2025
  • 150 Pages
  • United States
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Asia-Pacific Multi-Layer Ceramic Capacitor Market Outlook, 2030 - Product Thumbnail Image

Asia-Pacific Multi-Layer Ceramic Capacitor Market Outlook, 2030

  • Report
  • June 2025
  • 97 Pages
  • Asia Pacific
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Semiconductor Packaging is a process that involves the assembly of integrated circuits (ICs) into a package that can be used in electronic devices. It is a critical step in the semiconductor manufacturing process, as it ensures that the ICs are properly protected and connected to the device. The packaging process includes the selection of the package type, the assembly of the ICs into the package, and the testing of the package. The semiconductor packaging market is driven by the increasing demand for consumer electronics, such as smartphones, tablets, and laptops. The market is also driven by the increasing demand for advanced semiconductor packaging technologies, such as flip chip, wafer-level packaging, and 3D packaging. The semiconductor packaging market is highly competitive, with a number of major players, such as Amkor Technology, ASE Technology, STATS ChipPAC, and Chipbond Technology. These companies offer a wide range of products and services, including package design, assembly, and testing. Show Less Read more