- Report
- November 2022
- 86 Pages
Global
From €2151EUR$2,450USD£1,861GBP
- Report
- October 2022
- 53 Pages
Global
- Report
- July 2023
- 134 Pages
Global
From €3907EUR$4,450USD£3,380GBP
- Report
- July 2023
- 132 Pages
Global
From €3907EUR$4,450USD£3,380GBP
- Report
- November 2023
- 185 Pages
Global
From €3950EUR$4,500USD£3,418GBP
- Report
- November 2023
- 189 Pages
Global
From €3950EUR$4,500USD£3,418GBP
- Report
- October 2023
- 189 Pages
Global
From €3950EUR$4,500USD£3,418GBP
- Report
- August 2025
- 150 Pages
China
From €3380EUR$3,850USD£2,924GBP
€4258EUR$4,850USD£3,684GBP
- Report
- March 2024
Global
From €3380EUR$3,850USD£2,924GBP
€4258EUR$4,850USD£3,684GBP
- Report
- November 2025
- 150 Pages
Canada
From €3380EUR$3,850USD£2,924GBP
€4258EUR$4,850USD£3,684GBP
- Report
- October 2025
- 150 Pages
Germany
From €3380EUR$3,850USD£2,924GBP
€4258EUR$4,850USD£3,684GBP
- Report
- August 2025
- 150 Pages
Germany
From €3380EUR$3,850USD£2,924GBP
€4258EUR$4,850USD£3,684GBP
- Report
- August 2025
- 150 Pages
Canada
From €3380EUR$3,850USD£2,924GBP
€4258EUR$4,850USD£3,684GBP
- Report
- July 2025
- 150 Pages
South Africa
From €3380EUR$3,850USD£2,924GBP
€4258EUR$4,850USD£3,684GBP
- Report
- July 2025
- 150 Pages
Mexico
From €3380EUR$3,850USD£2,924GBP
€4258EUR$4,850USD£3,684GBP
- Report
- July 2025
- 150 Pages
Brazil
From €3380EUR$3,850USD£2,924GBP
€4258EUR$4,850USD£3,684GBP
- Report
- December 2024
- 150 Pages
Global
From €3380EUR$3,850USD£2,924GBP
€4258EUR$4,850USD£3,684GBP
- Report
- November 2024
- 150 Pages
Global
From €3380EUR$3,850USD£2,924GBP
€4258EUR$4,850USD£3,684GBP
- Report
- April 2024
- 150 Pages
Global
From €3380EUR$3,850USD£2,924GBP
€4258EUR$4,850USD£3,684GBP
- Report
- April 2024
Global
From €3380EUR$3,850USD£2,924GBP
€4258EUR$4,850USD£3,684GBP

Semiconductor Packaging is a process that involves the assembly of integrated circuits (ICs) into a package that can be used in electronic devices. It is a critical step in the semiconductor manufacturing process, as it ensures that the ICs are properly protected and connected to the device. The packaging process includes the selection of the package type, the assembly of the ICs into the package, and the testing of the package.
The semiconductor packaging market is driven by the increasing demand for consumer electronics, such as smartphones, tablets, and laptops. The market is also driven by the increasing demand for advanced semiconductor packaging technologies, such as flip chip, wafer-level packaging, and 3D packaging.
The semiconductor packaging market is highly competitive, with a number of major players, such as Amkor Technology, ASE Technology, STATS ChipPAC, and Chipbond Technology. These companies offer a wide range of products and services, including package design, assembly, and testing. Show Less Read more