Chemical Mechanical Planarization (CMP) Slurry Additives Market Global Report 2026

The chemical mechanical planarization (CMP) slurry additives market size has grown strongly in recent years. It will grow from $0.83 billion in 2025 to $0.9 billion in 2026 at a compound annual growth rate (CAGR) of 9.1%. The growth in the historic period can be attributed to increasing semiconductor manufacturing capacity expansion, growing demand for advanced integrated circuits, rising adoption of CMP processes in wafer fabrication, expanding electronics production and semiconductor applications, and increasing need for improved wafer surface quality and defect reduction.

The chemical mechanical planarization (CMP) slurry additives market size is expected to see strong growth in the next few years. It will grow to $1.26 billion in 2030 at a compound annual growth rate (CAGR) of 8.7%. The growth in the forecast period can be attributed to increasing demand for advanced semiconductor nodes and miniaturized devices, growing investments in semiconductor fabrication facilities, rising adoption of high-performance CMP slurry formulations, expanding demand for artificial intelligence and high-performance computing chips, and increasing focus on sustainable semiconductor manufacturing processes. Major trends in the forecast period include increasing demand for advanced CMP slurry additives for next-generation semiconductor nodes, growing development of low-defect polishing solutions for high-performance wafers, rising adoption of customized additive formulations for advanced semiconductor materials, expansion of CMP applications in emerging semiconductor fabrication processes, and increasing focus on improving slurry efficiency and reducing chemical consumption.

The expansion of semiconductors is expected to drive the growth of the chemical mechanical planarization (CMP) slurry additives market in the coming years. A semiconductor is a material with electrical conductivity between that of a conductor and an insulator, allowing the controlled flow of electricity in electronic devices. Semiconductor demand is increasing mainly due to the rising global adoption of advanced digital technologies such as smartphones, AI, EVs, and cloud computing, which require large volumes of high-performance chips. CMP slurry additives support semiconductor manufacturing by improving the performance of chemical mechanical polishing (CMP), enhancing material removal rates, controlling surface smoothness, and reducing defects to achieve the ultra-flat, defect-free surfaces required for advanced chip fabrication. For instance, in February 2025, according to the Semiconductor Industry Association, a US-based semiconductor industry association, global semiconductor sales increased from $526.8 billion in 2023 to $627.6 billion in 2024, representing a 19.1% year-over-year increase. Therefore, the expansion of semiconductors is driving the growth of the chemical mechanical planarization (CMP) slurry additives market.

Major companies operating in the chemical mechanical planarization (CMP) slurry additives market are focusing on developing innovative solutions, such as ultra-precision interconnect planarization slurry, to improve surface uniformity, enhance defect control, and support advanced semiconductor node scaling. Ultra-precision interconnect planarization slurry refers to a specially engineered chemical mechanical planarization (CMP) slurry designed to remove microscopic surface irregularities from semiconductor wafers with extremely high precision, enabling smooth and defect-free interconnect layers for advanced chip fabrication. For instance, in September 2025, FUJIFILM Corporation, a Japan-based technology company, launched a new CMP slurry for advanced semiconductor packaging, designed to support hybrid bonding technology used in next-generation AI semiconductors. The product enables high-precision planarization of bonding surfaces containing both copper and oxide films, improving chip integration performance and manufacturing efficiency. It has already been adopted by a major semiconductor device manufacturer and is expected to be expanded for applications such as redistribution layers and micro-bump bonding in advanced packaging processes.

In October 2023, Fujifilm Holdings Corporation, a Japan-based technology and materials company, acquired the Electronic Chemicals (EC) business from Entegris, Inc. for $700 million. Through this acquisition, Fujifilm Holdings Corporation aimed to strengthen its semiconductor materials portfolio by expanding its electronic chemicals product range, enhancing global manufacturing capabilities, and improving supply chain resilience for semiconductor customers worldwide. Entegris Inc. is a US-based manufacturing company that develops electronic chemicals and advanced materials for semiconductor manufacturing, including CMP-related process materials.

Major companies operating in the chemical mechanical planarization (CMP) slurry additives market are AGC Inc., BASF SE, DuPont de Nemours Inc., Entegris Inc., Evonik Industries AG, Fujifilm Corporation, Fujimi Incorporated, JSR Corporation, Kanto Chemical Co. Inc., Merck KGaA, Mitsubishi Chemical Group Corporation, Nissan Chemical Corporation, Polysciences Inc., Resonac Corporation, Soulbrain Co. Ltd., Sumitomo Chemical Co. Ltd., The Dow Chemical Company, Tokuyama Corporation, Vibrantz Technologies, Wacker Chemie AG.

North America was the dominant region in the chemical mechanical planarization (CMP) slurry additives market in 2025. Asia-Pacific is expected to be the rapidly growing region in the forecast period. The regions covered in the chemical mechanical planarization (CMP) slurry additives market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the chemical mechanical planarization (CMP) slurry additives market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

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