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Results for tag: "Flip Chip"

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Underfill Dispensers - Global Strategic Business Report - Product Thumbnail Image

Underfill Dispensers - Global Strategic Business Report

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  • 304 Pages
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Underfill Materials: Global Strategic Business Report - Product Thumbnail Image

Underfill Materials: Global Strategic Business Report

  • Report
  • April 2024
  • 273 Pages
  • Global
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Global High End Semiconductor Packaging Market 2024-2028 - Product Thumbnail Image

Global High End Semiconductor Packaging Market 2024-2028

  • Report
  • March 2024
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Global Semiconductor Advanced Packaging Market 2024-2028

  • Report
  • December 2023
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Global Semiconductor Packaging Materials Market 2023-2027 - Product Thumbnail Image

Global Semiconductor Packaging Materials Market 2023-2027

  • Report
  • June 2023
  • 206 Pages
  • Global
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Chiplets Global Market Report 2024 - Product Thumbnail Image

Chiplets Global Market Report 2024

  • Report
  • March 2024
  • 175 Pages
  • Global
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Flip Chip is a type of hardware packaging technology used in the electronics industry. It is a method of mounting integrated circuits (ICs) onto a substrate or printed circuit board (PCB) by flipping the chip upside down and connecting it directly to the substrate. This method eliminates the need for wire bonding and allows for higher density packaging. Flip Chip technology is used in a variety of applications, including consumer electronics, automotive, medical, and industrial. The Flip Chip market is expected to grow in the coming years due to the increasing demand for miniaturized electronic components and the need for higher performance and reliability. The market is also driven by the increasing demand for consumer electronics, such as smartphones, tablets, and laptops. Some of the major companies in the Flip Chip market include Intel, Samsung, Qualcomm, Texas Instruments, and STMicroelectronics. Show Less Read more