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Results for tag: "Flip Chip"

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Flip Chip Market Overview, 2024-29 - Product Thumbnail Image

Flip Chip Market Overview, 2024-29

  • Report
  • September 2024
  • 95 Pages
  • Global
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The Global Thermal Interface Materials Market 2026-2036 - Product Thumbnail Image

The Global Thermal Interface Materials Market 2026-2036

  • Report
  • August 2025
  • 395 Pages
  • Global
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Ball Grid Array (BGA) Packaging Market Report 2025 - Product Thumbnail Image

Ball Grid Array (BGA) Packaging Market Report 2025

  • Report
  • May 2025
  • 175 Pages
  • Global
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Flip Chip is a type of hardware packaging technology used in the electronics industry. It is a method of mounting integrated circuits (ICs) onto a substrate or printed circuit board (PCB) by flipping the chip upside down and connecting it directly to the substrate. This method eliminates the need for wire bonding and allows for higher density packaging. Flip Chip technology is used in a variety of applications, including consumer electronics, automotive, medical, and industrial. The Flip Chip market is expected to grow in the coming years due to the increasing demand for miniaturized electronic components and the need for higher performance and reliability. The market is also driven by the increasing demand for consumer electronics, such as smartphones, tablets, and laptops. Some of the major companies in the Flip Chip market include Intel, Samsung, Qualcomm, Texas Instruments, and STMicroelectronics. Show Less Read more